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Checking Wafer Position
While conventional systems are required to capture discrete images to ensure high resolution, wide-area imaging allows capturing the entire field of v...
In addition to being able to capture the entire field of view at once, the camera's angle sensor ensures reproduction capabilities even when mounted a...
If there is only a slight difference between the inspection target location and the background, damage to the profile may be difficult to inspect. Wit...
The LK-G Series range includes an ultra-long range sensor head that can be mounted 1 m from the target. This allows measurements via the viewport. The...
Conventional systems (such as ink) require that each defective chip be moved out of the stack and marked individually. The laser marker can perform to...
Before milling the bottom surface, the wafer tape applied to protect the surface of the wafer is cut. Before removal, the wafer tape is irradiated wit...
To ensure stable code reading, even when marked in confined spaces, KEYENCE markers allow users to select the optimal 2D code marking pattern taking i...
Lasers make it possible to increase the bond strength of aluminum molds and plastic molds and to control the wettability of the paste.The ability to i...
During resin encapsulation, in addition to cutting the gate, any weld residue or flashing that occurs must be removed. Lasers are used to remove resin...
With high pixel machine vision, the entire PCB can be captured in the field of view. This step allows simultaneous inspection to measure the pitch of...
Product Type Differentiation or 2D Identification of IC Packages
Reads 2D characters/codes marked with a laser on the surface of the IC chip. A single machine vision can recognize both characters, such as part numbe...
